Taiwan's Ministry of Economic Affairs said on 2 September that Taiwanese companies had initiated an additional US$20 billion of investment in the United States. The announcement does not identify the companies, projects or states, so this amount is not allocated to any project row and is not added to the site-level total below.
TSMC's own current Arizona material now describes a planned $265 billion investment programme covering six logic fabs, two advanced-packaging facilities and an R&D centre. That newer company-level programme supersedes the older $65 billion, three-fab snapshot shown in the original tracker row below. The first fab is operating, the second fab structure is complete, and additional facilities remain at different construction and planning stages.
| Development | Geography | Verified scale | Tracker treatment | Primary source |
|---|---|---|---|---|
| Taiwanese industry additional US investment wave | United States, sites not disclosed | US$20bn | Unallocated reference only. Not distributed across states or existing company programmes. | Taiwan MOEA |
| TSMC Arizona advanced-manufacturing programme | Arizona | $265bn planned investment; six logic fabs, two advanced-packaging facilities and an R&D centre | Supersedes the earlier $65bn three-fab programme snapshot. Facility stages remain separate. | TSMC Arizona |
This update is displayed separately so the historical project table is not silently rewritten. ACR will fold the revised TSMC programme into the next full dataset rebuild while preserving the original federal-award context.
Scope rule: this tracker currently covers semiconductor fabs, advanced packaging and strategic manufacturing supply-chain projects. Large data-center projects are covered as an adjacent investment theme but are not added to the semiconductor total. See ACR's analysis of West Virginia's $81 billion data-center investment wave.
For definitions, source hierarchy, update policy and correction standards, read the publication's full research methodology.
A state-level tracker of major US semiconductor fabs, packaging plants and supply-chain investments, with programme values, federal awards and project status kept separate.
The US semiconductor investment cycle spans leading-edge fabs, memory, advanced packaging, photonics and the less visible equipment and materials required to run a domestic supply chain. This tracker keeps private investment programmes and federal incentive awards in separate terms rather than adding them together.
A federal award does not mean the full private programme has already been spent. Project stage is therefore maintained independently from the announced capital figure.
| Company / project | State | Disclosed investment or award | Stage at review date | Primary source |
|---|---|---|---|---|
| Micron Clay megafab | New York | Approx. $100bn long-term New York vision; part of $6.165bn final CHIPS award covering NY and Idaho | Construction began in 2026; first concrete poured July 2026 | Source |
| Micron Boise leading-edge memory expansion | Idaho | Approx. $25bn long-term Idaho investment vision; part of $6.165bn final CHIPS award covering NY and Idaho | Final CHIPS award in place; multi-year manufacturing expansion | Source |
| Micron Manassas legacy DRAM expansion | Virginia | Project supported through a separate preliminary CHIPS memorandum in the 2024 Micron package | Preliminary federal terms announced; not counted as a final award in this tracker | Source |
| Samsung Taylor leading-edge logic fabs and R&D | Texas | More than $37bn broader Central Texas investment programme; up to $4.745bn final CHIPS award | Final CHIPS award; Taylor campus development programme | Source |
| TSMC Phoenix three-fab programme | Arizona | More than $65bn three-fab plan in final CHIPS award; later company plans may be larger | First fab operating; additional fabs in development | Source |
| Intel Ohio leading-edge fabs | Ohio | Part of Intel's nearly $90bn CHIPS-supported US investment through decade end | Final CHIPS award; multi-year fab construction programme | Source |
| Intel Arizona expansion | Arizona | Part of Intel's nearly $90bn CHIPS-supported US investment through decade end | Final CHIPS award; expansion programme | Source |
| Intel New Mexico advanced packaging | New Mexico | Part of Intel's nearly $90bn CHIPS-supported US investment through decade end | Final CHIPS award; packaging expansion programme | Source |
| Intel Oregon R&D and manufacturing | Oregon | Part of Intel's nearly $90bn CHIPS-supported US investment through decade end | Final CHIPS award; R&D and manufacturing investment programme | Source |
| GlobalFoundries Malta expansion | New York | Approx. $13bn combined US investment over 10+ years; up to $1.5bn final CHIPS award | Final CHIPS award; new and expanded capacity programme | Source |
| GlobalFoundries Burlington modernisation | Vermont | Included in approx. $13bn US programme and final CHIPS award | Final CHIPS award; modernisation and capacity investment | Source |
| Texas Instruments Sherman fabs | Texas | Part of more than $18bn for three new fabs through decade end; up to $1.61bn final CHIPS award | Final CHIPS award; fab construction programme | Source |
| Texas Instruments Lehi fab | Utah | Part of more than $18bn for three new fabs through decade end; up to $1.61bn final CHIPS award | Final CHIPS award; fab investment programme | Source |
| Amkor advanced packaging and test facility, Peoria | Arizona | Approx. $2bn private investment; up to $407m final CHIPS award | Final CHIPS award; greenfield packaging project | Source |
| SK hynix HBM packaging and R&D, West Lafayette | Indiana | Approx. $3.87bn investment; up to $458m final CHIPS award | Groundbreaking held August 2026; production targeted later in decade | Source |
| Microchip Colorado Springs fab expansion | Colorado | Approx. $90m proposed CHIPS support within $162m two-site preliminary package | Preliminary CHIPS terms; modernisation and expansion project | Source |
| Microchip Gresham fab expansion | Oregon | Approx. $72m proposed CHIPS support within $162m two-site preliminary package | Preliminary CHIPS terms; expansion project | Source |
| BAE Systems Microelectronics Center, Nashua | New Hampshire | Up to $35.5m final CHIPS award | Final award; modernisation intended to quadruple MMIC production capacity | Source |
| Rocket Lab / SolAero compound semiconductor expansion, Albuquerque | New Mexico | Up to $23.9m final CHIPS award | Final award; modernisation and expansion intended to raise production by 50% | Source |
| Corning semiconductor-grade glass expansion, Canton | New York | Up to $32m final CHIPS award | Final award; production expansion and process scale-up | Source |
| Edwards Vacuum dry-pump plant, Genesee County | New York | Up to $18m final CHIPS award | Final award; greenfield semiconductor equipment manufacturing facility | Source |
| Infinera photonic semiconductor fab, San Jose | California | Part of up to $93m final CHIPS award across California and Pennsylvania | Final award; new fab intended to expand domestic InP PIC capacity | Source |
| Infinera advanced test and packaging, Bethlehem | Pennsylvania | Part of up to $93m final CHIPS award across California and Pennsylvania | Final award; new packaging and test facility | Source |
| Entegris semiconductor materials centre, Colorado Springs | Colorado | Up to $77m final CHIPS award | Final award; state-of-the-art materials manufacturing centre | Source |
| Absolics glass-core substrate facility, Covington | Georgia | Up to $75m final CHIPS award; 120,000 sq ft facility referenced by Commerce | Final award; construction and technology scale-up programme | Source |
Rows represent identifiable US facilities or site-level programmes with company or Department of Commerce sourcing. Where one federal award covers several states, the award is described as part of a multi-site package rather than duplicated as if each site received the full amount.
Final awards, preliminary memoranda, construction milestones and operating production are different states. The tracker uses conservative language when a current site-level construction milestone has not been separately refreshed.
These research pages are maintained as reference datasets rather than one-off news stories. Readers citing a table should include the review date because company, regulatory and project status can change materially between updates.